The choice of wave soldering machine should be based on process requirements and process characteristics of PCB manufacturing. For example, if the the product output is large, it is necessary to consider the use of a long preheating zone; if the surface treatment of the PCB is OSP, a wave soldering machine that can be added with nitrogen should be used; if the penetration tin is the main problem of soldering, the smoothing wave should be wider. Wave soldering machine; if bridging is the main welding problem, a narrower wave soldering machine with a smoother wave should be used.
Wave soldering machines must be selected according to the process characteristics of their products.
In addition, not all wave soldering equipment manufacturers are experts in wave soldering technology. Some manufacturers’ equipments are plagiarized on the basis of not understanding the principle, and they are not mastered key points. Therefore, some key technical points must be confirmed when selecting a device, for example:
(1) Coverability and uniformity of the flux sprayed film.
(2) The length of the preheating zone and the interval between the preheating zone and the turbulent wave.
(3) The interval between the turbulent wave and the smooth wave (note that it is not the distance between the nozzles, but the interval between the two tin waves on the PCB soldering surface), which has a relatively large influence on the soldering temperature.
(4) If you are purchasing a nitrogen-filled wave soldering equipment, make sure that the nitrogen tunnel top cover can be opened to allow welding of some heat-resistant components.
, and connect them to complete specific functions of the circuit. Compared with discrete component circuits, integrated circuits greatly reduce the volume, weight, number of lead wires and solder joints of point circuits, and improve circuit performance and reliability. The miniaturization, minia...
PCB circuit board proofing or board making requires a lot of information, and the difference in each item will have a huge impact on the final price. Size, board thickness, surface treatment, resistance resistance, solder mask coverage, solder mask color, gold finger, copper foil thickness, etc. ...
Intelligent, compound, integrated and diversified. This is the development trend of robots now and in the future, with variety, functions and intelligence. The most important point is: miniaturization. Just like the core focus of the Huawei incident, the ultimate root cause is the competition in ...