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T800 lead-free solder paste features

T800 lead-free solder paste features

T800 Solder Paste is a lead-free, halogen-free, no-clean solder paste for ultra-fine process printing. It has a wide process window and provides a pcb smt process solution for 01005 inch components. Excellent print performance can be workable in 8 hours. Excellent reflow process window allows for good soldering of Cu OSP boards even with high wetting curves. A good combination of printing effect of various sizes. Excellent anti-collapse performance is very good at inhibiting the generation of irregular tin beads. The solder joints are excellent in appearance and easy to visually inspect. The void performance reaches the IPC CLASS III level and the IPC flux is classified as ROLO to ensure product environmentally and reliability.

 

T800 lead-free solder paste features and advantages

 

 

Oct-09-2019

FASTPCBA