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PCB manufacturing MIS-POS baord



+86 755 26978877



Shenzhen Guangming yulv Village Road Jade Spring beauty industrial district 18-1 building 3 floor

PCB manufacturing MIS-POS baord
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PCB manufacturing MIS-POS baord
Basic information about the board:
Production model: 4C5802F0
Product Name: CIE 045.710
Product use: card reader
Order Quantity: 1000pcs
Production process: lead-free process
Order Type: Return Order
Pcb sheet information: 4 layers FR4, board thickness 1.6mm, copper thickness 1OZ, lead-free spray tin, green oil white, ENIG, single piece size: 125mm*53.73mm
Project requirements: PCBA one-stop
Pcba manufacturing process: SMT→DIP→burning→test→assembly
SMT points: 280
Dip points: 80
Other requirements for PCBa products: 1. The customer confirms the return order. The PCB has no change. The CN6 customer material code has changed. The material of the SIM card was found to be inconsistent with the pad during the last production, and then changed to the same model as the 8C5801D0. Pay attention to whether the production documents of our company are correct before. 2. Suggest that the project can be compared with the previous production Bom.

Solder paste requirements: Aa3.0/Cu0.5/20-38uM.

Special requirements: 1 module and card holder are not offset;
Reflow soldering temperature setting: preheating and constant temperature zone operation according to “reflow soldering furnace temperature management specification” reflow soldering maximum temperature is between 245-247 degrees, super 230 °C welding time control 40-60S.

Product Name:PCB manufacturing MIS-POS baord

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