/Wave soldering machine how to solve the technical difficulties of SMT
There are two technical difficulties when soldering an SMT board with a general wave soldering machine.
(1) Bubble blocking effect. During the soldering process, the bubbles generated by the flux being volatilized by the heat are not easily discharged, and are shielded on the solder joints, which may cause the solder to fail to contact the soldered surface to form a solder joint.
(2) Shadow effect. In a double-sided hybrid soldering process, when a printed circuit board passes over the peak of the solder melt, the higher SMT component blocks the dead angle around the shorter or adjacent SMT component behind it, forming The shaded area prevents the solder from flowing over the soldered surface, resulting in poor soldering or poor soldering.
In order to overcome these SMT soldering defects, in addition to welding methods such as reflow soldering, many new or improved wave soldering devices have been developed, effectively eliminating the original defects and creating hollow waves, plain waves, and combinations. Waves and other new peak forms.
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