With the development of miniaturization and precision of electronic products, the density of PCBA processing and assembly used by patch processing plants is getting higher and higher, and the solder joints in the circuit boards are getting smaller and smaller, and the mechanics and electricity they carry. And the thermodynamic load is getting heavier and heavier, and the reliability requirements are increasing. However, in the actual processing process, PCBA solder joint failure will also be encountered. It is necessary to analyze the cause in time to avoid recurring solder joint failure. The main reason for PCBA solder joint failure:
1. Poor component leads: plating, contamination, oxidation, coplanar;
2, PCB pad defects: plating, pollution, oxidation, warping;
3. Solder quality defects: composition, impurities exceeding the standard, oxidation;
4, flux quality defects: low solderability, high corrosion, low SIR;
5. Process parameter control defects: design, control, equipment;
6, other auxiliary materials defects: adhesives, cleaning agents.
PCBA solder joint failure has a great impact on the performance of the board. Therefore, in the PCBA processing process, the design process, structural parameters, and soldering process should be continuously improved according to the actual situation, the solder joint reliability should be improved, and the yield of PCBA processing should be improved.
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