PCBA Technology News - 2019 Innovations and Future Tech

Selectitve welding equipemt composition and technical points

(1) Flux spraying system The selective welding adopts the selective flux spraying system, that is, the flux nozzle is run to the designated position according to the pre-programmed program instructions, and only spay where the welding is required on the circuit board(point spray and line spray), ...

11月-12-2019
Reflow soldering furnace temperature curve design considerations

During the manufacturing process of the circuit board, the temperature setting of the reflow oven determines the temperature resistance and soldering effect of the components. Sometimes it is not possible to debug as request when debugging the temperature curve. This is because for a specific pac...

11月-11-2019
Selection of wave soldering equipment

The choice of wave soldering machine should be based on process requirements and process characteristics of PCB manufacturing. For example, if the the product output is large, it is necessary to consider the use of a long preheating zone; if the surface treatment of the PCB is OSP, a wave solderi...

11月-07-2019
Components detection method after PCB assembly

Online needle bed test method ICT. In the actual pcb assembly and manufacturing, in addition to the solder joint quality is not qualified, which will lead to welding defects, component polarity is wrong, component types are mislabeled, and the value exceeds the nominal allowable range, which may ...

11月-05-2019
Pcb assembly flux separation reasons

1.Flux separation Ideally, the solder paste should be a homogeneous mixture of flux and solder powder. However, solder paste sometimes shows flux separation when the container is opened. There us a typical symptom that yellow flux layer on top of the off-white solder paste, either in the can or i...

11月-04-2019
PCB Prototyping Neutral Monument Improvement Suggestions

1. Process or design aspects (1) Select a wider chip component (the size of the plating along the length of the component, the width of the non-package). (2) Appropriate spacing is used between the two pads of the chip component. (3) The extension of the pad beyond the terminal of the chip compon...

10月-30-2019
PCB prototype tombstone causes

Tombstone is one end of a pin less component (such as a capacitor or resistor) that is lifted and stands on top of its other end, as shown in figure 1.Tombstone is also known as the Manhattan effect, suspension bridge effect.It is caused by unbalanced wetting at both ends of the component during ...

10月-30-2019