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How does the Pcba factory better disassemble components?

How does the Pcba factory better disassemble components?

It is generally not so easy for the Pcba factory to remove the components. It is necessary to practice constantly to be proficient, otherwise it is easy to destroy smd components if forced to disassemble. The mastery of these skills is of course subject to practice. It is roughly divided into three cases to describe.
  1. For components with less printed circuit board components, such as resistors, capacitors, diodes, and triodes, first plate the tin on one of the pads on the PCB, then place the left hand with the tweezers to place the component and place it against the circuit. Plate, right hand solder the pins on the tinned pads with a soldering iron. The left hand tweezers can be loosened and the tin wire is used to weld the remaining feet. It is also very easy to disassemble such components, as long as the two ends of the component are heated simultaneously with a soldering iron, and the components can be removed after the solder is melted.

Pcba factory
   Second, for the components of the pcba factory with more components and pins, the patch components with wider spacing are similarly applied. First, tin is plated on one of the pads, and then the left hand is soldered with a pair of tweezers. Then solder the remaining feet with tin wire. The disassembly of such components is generally better with a heat gun, a hand-held hot air gun blows the solder, and the other hand removes the component with a clamp such as a tweezers.
  Third, for components with high pin density, the soldering step is similar, that is, solder one foot first, then solder the remaining feet with tin wire. The number of pins is relatively large and dense, and pin-to-pad alignment is critical. Usually the pads are selected on the corners, only a small amount of tin is plated, the components are aligned with the pads with tweezers or hands, the sides of the pins are aligned, the components are pressed on the PCB with a little force, and the solder is soldered with a soldering iron. The corresponding pins of the disk are soldered. Instead of shaking the board vigorously, turn it gently and solder the pins on the remaining corners first. When all four corners are soldered, the components will not move at all, and the remaining pins will be soldered one by one. Apply some loose perfume first when welding, a small amount of tin on the tip, and one pin at a time.
  Finally, it is recommended that the high-pin-density components be disassembled mainly with a heat gun, clamp the components with tweezers, blow all the pins back and forth with a heat gun, and lift the components when they are melted. If the removed component is still needed, then try not to face the center of the component when blowing, and the time should be as short as possible. After removing the components, clean the pads with a soldering iron.
The above is the desoldering technique of the pcba factory. FASTPCBA Technology will also continue to improve quality and provide customers with high quality PCBA manufacturing services.

Jan-18-2019

FASTPCBA