In the process of PCBA assembly and welding, all plug-in circuit boards need to use wave soldering, so when using wave soldering, improper components or craft problems may easily cause defects such as poor wetting, welding leakage, virtual welding and so on.so how should the peak quality problems be solved?
1.Components should be used firstly for first-come , do not store in a humid environment, do not exceed the specified use period. Clean and dehumidify the PCB.
2.Wave soldering should select surface mount components with three layers of end structure. The component body and soldering end can withstand the temperature shock of 260 °C wave soldering for twice.
3.When SMD/SMC adopts wave soldering, the layout and arrangement direction of components should follow the principle of small components in front and avoiding mutual block. In addition, it is also possible to appropriately lengthen the length of the remaining pads after the components are overlapped.
4.The warpage of PCB should be less than 0.8% to 1.0%.
5.Adjust the horizontal level of the wave soldering machine and the conveyor belt or PCB transmission frame.
6.Clean the nozzle.
7.Replace the flux.
8 .Set the proper preheating temperature.
The above are solutions for the poor quality of wave soldering shared by PCB board suppliers.
Recently, some criminals have faked the name of Shenzhen FASTPCBA Technology Co., Ltd., illegally used our business license, illegally forged our website, WeChat, QQ, telephone information, etc. to deceive consumers, and their behavior is bad.
The solderability handling of components is actually the tin plating of the cleaned components’ lead. Tin plating is a very important process in manual welding operations. Only the welded surfaces of the components are welded,so that the reliability and speed of welding will improve and reduce th...
Reliability generally refers to the probability that a product will perform a specified task under specified conditions within a specified time. It is related to the corresponding load, usage environment, and application cycle. It is usually evaluated by using a temperature cycling method. The re...