Objective: according to the requirement of project data MI, to cut into small pieces on the large sheet.According to the customer’s requirements of small board.
Process: big board material, cut board according to MI request, curium board, beer round corner grinding edge, out board
Objective: according to the engineering data, drill the desired hole diameter at the corresponding position on the sheet material with the required size.
Procedure: laminated plate pin, upper plate, bore hole, lower plate, inspection and repair
Objective: to deposit a thin layer of copper on the wall of insulating hole by chemical method.
Process: rough grinding, hanging plate, sinking copper automatic line, lower plate, dipping rare H2SO4, thickening copper
Purpose: graphic transfer is the transfer of images on the production film to the board.
Process: (blue oil process) : grinding plate, printing on the first side, drying, printing on the second side, drying, lighting, stamping, inspection.(dry film process) : hemp plate, pressing film, static position, exposure, static position, impact shadow, inspection
Objective: pattern electroplating is to electroplate a layer of copper to the required thickness and a layer of gold, nickel or tin to the bare copper or hole wall of the circuit diagram.
Process: upper plate – oil removal – washing second – microetching – washing – pickling – copper plating – washing – pickling – tin plating – washing – washing – lower plate
Objective: to isolate the non – line copper layer by using NaOH solution.
Process: water film: socket – soaking-washing – scrubbing – passing machine;Dry film: put plate – over machine
Purpose: etching is to use chemical reaction method to corrode the copper layer of non-line part.
Objective: green oil is to transfer the graph of green oil film to the plate, which can protect the circuit and prevent the tin on the circuit when welding parts.
Process: grinding plate, printing green oil, curium plate, exposure, stamping;Grinding plate – first printing plate – second printing plate – second printing plate
Purpose: the character is provided as an identifiable mark.
Process: after the final curium of green oil, cooling and static setting, adjusting the network, printing characters, after curium
Objective: to coat the plug finger with a required thickness of nickel and gold to make it harder to wear.
Process: upper plate – oil removal – washing twice – microetching – washing twice – pickling – copper plating – washing – nickel plating – washing – gold plating
Purpose: the purpose of tin spraying is to spray a layer of lead tin on the exposed copper surface that is not covered with resistance soldering oil to protect the copper surface from corrosion and oxidation, so as to ensure good welding performance.
Process: micro etching, air drying, preheating, rosin coating, solder coating, hot air leveling, air cooling, washing and air drying
Objective: to make the shape shaping method for customers through mold stamping or CNC gong machine
Note: data gongs and the precision of the board and the board of the upper hand gong, the next, the minimum cutting board can only do some simple shape.
Objective: to detect the defects affecting functionality by electronic testing, such as undetectable open circuit and short circuit.
Procedure: upper mold, put plate, test, qualified, FQC eye inspection, unqualified, repair, return test, OK, REJ, scrap
Objective: to prevent the appearance defects and minor defects from coming out through visual inspection.
Specific working procedure: incoming material, checking data, eye inspection, FQA sampling inspection, packaging, disqualification, treatment, inspection
1.Snpb Hot Air Leveling craft. The Snpb Hot Air Leveling craft is a traditional PCB pad coating method. The specific craft process is immersed in the molten Snpb alloy after the PCB circuit is etched, and then slowly lifted and coated with a Snpb alloy layer under the action of hot air, which is ...
The width of the printed conductor depends on the current carrying capacity of the conductor and the allowable temperature rise. The thickness of the copper foil plated copper foil is generally 0.02 to 0.05 mm. The different widths printed conductors have different cross-sectional areas too. The ...
After the position and shape of the components on the PCB board are determined, the wiring can be performed according to the position of the components. The following are the basic requirements for the circuit board: The low frequency wires are placed close to the edge of the printed circuit boar...