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PCB manufacturing OSP coating technics

PCB manufacturing OSP coating technics

The OSP coating technics is one of the surface treatment technics of the pcb board, then what is the OSP coating technics?

What about the OSP coating technics ? In the process of pcb manufacturing, in order to make the copper surface of the pcb solder joint have good soldering performance in the subsequent fabrication, the manufacturer has to perform corresponding surface treatment on these potentials, such as tin-plating, electroplating nickel gold etc. OSP is an Organic Solder-ability Preservatives (OSP) which is one of a variety of surface treatment methods for PCB manufacturing.

 

At present, lead-free pcb manufacturing technology is more and more extensive, almost completely out of the traditional lead-based technics. Lead-free boards are mostly processed using the OSP coating technics. It is important to note that the lead-free OSP is not the same as the leaded OSP material. The decomposition temperature of the OSP must match the pcb soldering temperature, and the lead-free OSP is required to withstand higher temperatures.

 

The key to the high temperature resistance of OSP is the formulation and coating technics of OSP solution, which is the secret of OSP suppliers. At present, the international OSP has developed to the fifth generation, its decomposition temperature is 355 ° C, can withstand multiple heating, at present, the best foreign OSP technics can withstand 4 times, 5 times reflow soldering. Therefore, general consumer lead-free electronic products can choose OSP coating. The future development direction is to continuously improve the composition and technics of the OSP technics and the heat resistance temperature& heat resistance of the OSP.

7月-29-2019

FASTPCBA