Current page:

Home

/

News

/

Automobile body circuit board production process

Automobile body circuit board production process

Cars have gradually become an indispensable part of life for today’s people. Basically, due to extreme weather most people like driving or taking taxi.As been in the automotive electronics PCB manufacturing factory for a long time. In fact, a car is not just as simple as a few wheels plus an engine. It has a lot of electronic equipment. The most obvious thing is that it is a resource library with tens of thousands of lines of code. So did everyone think about a problem once using it, that is, how exactly are the electronic devices made from ?

Today, the cnfastpcb editor will analyze it with you in combination with current profession. Next, I would like to introduce to you technology that must be used in the production process of all electronic products, that is PCB manufacturing and assembly technology.

Simply speaking, pcb manufacturing and assembly is to print a solder paste on a designed PCB pad , and then place the resistance-capacitance components on the PCB surface through machinery and equipment furnace baking solidifies the solder paste, and the components are firmly soldered to the circuit board. It’s the finished product processed by PCBA. After passing the assembly test, it can be sent to the machine factory for installation and debugging.

Because the production and processing of automotive electronics requires IATF16949 quality management system certification, the entire processing process will be more strictly controlled for the quality details, including (car-standard PCB and car-standard components). Others are not very different from general product processing processes.

So what equipment compose the PCB assembly production line? Today cnfastpcb editor will share with you according to the actual production line equipment:

The first are: solder paste printer (solder paste spray machine), solder paste inspection instrument (SPI), SMT placement machine, AOI (online AOI and offline AOI), reflow oven, DIP plug-in machine, wave soldering furnace, loading and unloading Board machine, connection equipment, BGA rework station and other equipment, which also include production equipment and testing equipment.

Production equipment includes: solder paste printers (solder paste spray mahcine), SMT placement machines, reflow soldering furnaces, wave soldering furnaces are production equipment, SPI and AOI (online AOI and offline AOI) are inspection equipment , loading and unloading board machines, connection equipment, BGA rework station and other auxiliary equipment.

Analyze according to the process of pcb manufacturing production line. Solder paste printer: Print the solder paste on the bare board by opened stencil in advance, and scrape the solder paste from the steel stencil with scraper, and the solder paste will pass through the steel stencil holes, leak down and fall to the corresponding position of the PCB circuit board under the stencil.

 

Solder Paste Inspection Instrument (SPI): It uses the optical principle to inspect the solder dots of the solder paste after printing, to prevent the occurrence of  common problems like leakage printing, less tin, excessive tin, continuous tin, misalignment, poor shape, and surface pollution.

SMT placement machine: The material is sucked up through the placement nozzle, and the program is used to control the mechanical arm to mount the material on the corresponding solder joint on the PCB surface.

AOI (online AOI and off-line AOI): By using the principle of light reflection to detect the mouting condition of materials, whether there is a shift, leak materials, wrong parts, reverse parts, etc. After reflow soldering, it can detect whether there is less tin , excessive tin, displacement, poor shape and other issues, timely feedback of unqualified products.

Reflow soldering furnaces: There are many brands of reflow soldering furnaces on the market. There are roughly 10, 12, 14, 16, 18, 20 … temperature zones. The temperature in different temperature zones is gradient. The paste will solidify as the temperature increases or decreases.

BGA rework station: All are equipped with hot air vents. Manual inspection is repair parts which are caused by BGA problems.

Basically, after the BGA rework, the DIP plug-in can be tested and shipped.

12月-18-2019

FASTPCBA