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Pcb manufacturing craft process

Pcb manufacturing craft process

What is a craft process? The craft process is the operator’s operation and is used in pcb production, craft management and other specifications, and is the technical basis for pcb manufacturing products. Whether the surface assembly craft design is reasonable or not directly affects the quality of pcb assembly, production efficiency and the cost of pcb manufacturing. In the actual production process, the craft personnel should design a reasonable craft process according to the types of components and production equipment used and the needs of the products to meet the production needs of different product .

The pcb assembly craft has two basic craft processes, namely solder paste→reflow soldering craft and SMD adhesive→wave soldering craft. All the craft processes of pcb manufacturing are basically based on the two processes.

The solder paste→reflow soldering craft is shown in Figure 1. First, the appropriate amount of solder paste is printed on the printed circuit board welding pad, and then the chip components are placed on the printed circuit board at the specified position, and finally, the printed circuit board with the components mounted is passed through the reflow furnace to complete the welding process.Its characteristics are simple and fast, which is conducive to the reduction of product volume. This craft process is primarily suitable for surface-mount assembly components .

SMD glue → wave soldering craft shown in Figure 2, is to first apply a proper amount of adhesive glue between the printed circuit board welding pads, and then put the surface assembly components to the specified position of the printed circuit board, and then the printed circuit board on which the components are mounted is cured by glue, and then the components are inserted, and finally the plug-in components and the surface-assembled components are simultaneously wave-welded. It is characterized by the usage of double-panel space, the electronic product volume can be further reduced, and the through-hole components are partially used, and the price is low. This craft process is suitable for hybrid assembly of surface mount components and plug-in components.

 

Jul-03-2019

FASTPCBA