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PCB assembly process design requirements

PCB assembly process design requirements

PCB assembly is different from traditional through-hole insertion process (THT) in terms of component packaging, production equipment, assembly methods, and soldering processes. SMT uses reflow soldering technology, and the traditional through hole plug-in process (THT) uses wave soldering technology.

For the above reasons, PCB assembly and traditional THT PCB design rules are completely different. PCB assembly printed circuit board design must meet the requirements of “reflow” and “self-positioning effect” of PCB assembly equipment, surface assembly process and reflow soldering process.

 

 

The design requirements of the PCB assembly process mainly include the following:

  1. Determine the size and structural shape of the PCB according to the structure of the whole machine;
  2. Printed board assembly form and process design;
  3. PCB material selection;
  4. Component selection;
  5. SMC/SMD (mounting component) pad design;
  6. THC (through-hole plug-in components) pad design;
  7. Wiring design;
  8. Pad and printed wiring connection settings;
  9. Through conduction hole, test point setting;
  10. Solder mask, wire screen setting;
  11. Components overall layout settings;
  12. Reflow soldering and wave soldering chip component layout direction design;
  13. Components minimum spacing design;
  14. Template design.

Sep-04-2019

FASTPCBA