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Pcb assembly detection process characteristics

Pcb assembly detection process characteristics

Product inspection is one of the important processes in pcb manufacturing technology and an indispensable means in quality control.Circuit board product quality is the lifeline of the enterprise。Correct and advanced detection technology can not only ensure the board products are qualified, prevent the non-conforming products from being leaked into the market, but also reduce misjudgment, improve production efficiency and reduce the cost of pcb manufacturing.
The test content of pcb assembly includes incoming material inspection of electronic products, process inspection and pcb assembly board inspection.At present, the inspection methods in pcb manufacturing mainly include visual inspection, automatic optical inspection (AO1), automatic light detection (AXI), ultrasonic inspection, on-line measurement (ICT), and functional measurement.The most important of these is the inspection of each process.

Process inspection is also called process inspection. The contents of the Pcb assembly manufacturing process inspection include the printing solder paste process inspection, the placement process inspection, the reflow soldering process inspection (post-weld inspection), and the cleaning process inspection.Process inspection is an important means of process control of circuit board product quality management and has the following effects:Through the quality inspection of each process, in addition to being able to control the quality of each process, it can effectively control and avoid the defects of the previous process into the next process.;It is beneficial to check the cause of defects; it can avoid post-weld repair; it is beneficial to improve the assembly quality and production efficiency of pcb circuit board; it is beneficial to the reliability of the final product.

Therefore, Pcb assembly testing is very important.

Sep-11-2019

FASTPCBA