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Pcb assembly adhesive curing

Pcb assembly adhesive curing

The variety and curing method of Pcb assembly glues are different. There are two common curing methods: thermal curing and photo curing. The curing method of epoxy resin assembly glue is mainly heat curing, and the curing method of acrylic assembly glue is mainly photo curing.

What is thermal curing?

The thermal curing has two forms: oven discontinuity and reflow furnace continuous. oven discontinuity curing is to put the assembled PCB and the mounted SMD pcb into a constant temperature oven in batches, and solidify according to the curing parameters of the assembled glue, such as temperature 150 ° C, time 5 min; reflow soldering continuous curing is the most common method used in SMT craft. The setting method and process of the assembly glue temperature scratch curve are the same, but the thermocouple should be placed on the glue point. The temperature and time settings depend on the selected assembly glue.

The curing curve of epoxy resin assembly adhesives has two important parameters: heating rate and peak temperature. The heating rate determines the surface quality of the assembled adhesive after curing, and the peak temperature affects the bonding strength of the adhesive. Therefore, when setting the temperature curve, it should be noted that when the temperature exceeds 160 ° C, the curing process will be accelerated, which will cause adhesive point fragile.

 

7月-15-2019

FASTPCBA