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Packaging and direction discrimination of integrated circuit components

Packaging and direction discrimination of integrated circuit components

, and connect them to complete specific functions of the circuit. Compared with discrete component circuits, integrated circuits greatly reduce the volume, weight, number of lead wires and solder joints of point circuits, and improve circuit performance and reliability. The miniaturization, miniaturization and high reliability of electronic equipment are largely due to the application of integrated circuit boards.

Packaging is necessary for integrated circuit chips, but also crucial. Encapsulation refers to the enclosure installed in the new inquiry of the semiconductor integrated circuit. It not only plays the role of placing, fixing, sealing, protecting the chip and enhancing the thermal conductivity, but also connecting the internal world of the chip and the external circuit. The chip and the package enclosure The pins are connected, and these pins are connected to other components through the PCB.

Packaging and direction discrimination of integrated circuit components
1. Integrated circuit packaging in the manufacture of smt circuit boards.
The packaging of semiconductors (including integrated circuits and discrete components) has undergone several generations of changes, from dual in-line packages, small outline packages, quad flat packages, pin grid array packages, ball grid array packages to many Chip modules go to system-level packaging, and the technical indicators are being developed from generation to generation. At present, the ratio of chip area to package area is getting closer and closer to 1, the applicable frequency is getting higher and higher, the temperature resistance is getting better and better, and the number of pins is increasing , The pin spacing is reduced, the weight is reduced, the reliability is improved, and the use is more convenient. There are many types of packaging, and each type of packaging has its own unique place. The packaging materials, packaging equipment and packaging technology used vary according to different needs. According to different packaging materials, the packaging can be divided into metal packaging, ceramic packaging, metal-ceramic packaging and plastic packaging.

The chip package of the integrated circuit board used in smt is developed from the pin-in-line package. Its advantage is to reduce the difficulty of printed circuit board design, while also greatly reducing its own size, thus Increase the density of integrated circuit boards on the printed circuit board. However, the disadvantage of the chip with this assembly method is that it is difficult to disassemble the components without special tools. Integrated circuits can be divided into: SOP, LCCC (leadless ceramic chip carrier) leadless ceramic chip carrier, PLCC (plastic leaded chip carrier) leaded plastic package carrier, PQFN (plastic quad flat no-lead package) ) Square flat no-lead plastic package, QFP/BGA/FCHE MCM, etc.

8月-03-2020

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