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why not plate gold on the surface of copper?

why not plate gold on the surface of copper?

There is a large amount of metal copper on the circuit board, but there is a certain influence on gold plating on the printed circuit board. Why can’t gold be directly plated on the surface of copper?

Due to the high porosity of the gold-plated layer of the board, copper can seep out from the pores of the gold layer, affecting reliability. For example, the long time at the gold finger will “long” out the green hair, which is the reason why copper seepage is oxidized and corroded.

The following is a solution for FASTPCBA: a Ni barrier between copper and gold to prevent copper from oozing out.
In all metal systems, the Ni-containing interlayer is considered to have a more stable solder joint interface, and the solder wets on the Ni surface during soldering to form a tin-nickel covalent compound. Therefore, for the case where the node strength (especially the contact connection) is required to be high, the method of electroplating nickel/gold is often used.

7月-25-2019

FASTPCBA