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Lead-free solder joints’ reliability

Lead-free solder joints’ reliability

Reliability generally refers to the probability that a product will perform a specified task under specified conditions within a specified time. It is related to the corresponding load, usage environment, and application cycle. It is usually evaluated by using a temperature cycling method.

The reliability of lead-free interconnects is a very complex issue, and simply depends on the “acceleration factor” of the test.

In most applications, the product is in the environment of 0-100 ° C, the load is relatively low, lead-free is more reliable than lead ; but for automotive electronics, military products, the operating temperature is often below 50–150 ° C. The solder joints are subjected to a large load, and the lead solder joints are often more reliable than the lead-free solder joints.



The lead-free craft and ROHS are two concepts. The lead-free craft refers to the usage of lead-free solder. It is a crafts technology that realizes interconnecting PCB and SMD that meet ROHS requirements.

The lead-free craft has the following characteristics compared to the lead craft:

1.Increased solder melting point

2.Insufficient spreading

3.The fluidity is deteriorated, and the fluidity of the lead-free solder is deteriorated due to the relative shortage of the superheating temperature, and the melting of the copper at a high temperature causes the fluidity to be worse, and in general, the weldability is deteriorated.