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Do you know the temperature resistance of printed circuit boards?

Do you know the temperature resistance of printed circuit boards?

In order to guarantee the quality of semi-finished PCB, the reliability and adaptability of PCB should be tested in the production process.Some special environment and temperature control requirements, we will have the furnace temperature test each circuit board temperature degree.Generally, the maximum temperature of reflow welding is around 260 degrees. If it exceeds this temperature, the components on the circuit board will be melted, affecting the quality of the circuit board.

printed circuit boards

The printed circuit board service factory needs to conduct temperature tolerance test on each welding board and components, in order to prevent PCB circuit board from bursting board, foaming, delamination and other

adverse reactions under high temperature, leading to poor product quality or directly scrapping, which is a problem that needs to be paid attention to.What is the temperature resistance of PCB, and how to do the heat resistance test?Let the FASTPCBA technician learn about it:

The temperature of PCB is related to the temperature of raw materials, solder paste and surface parts. Usually, PCB can withstand up to 300 degrees, 5-10 seconds.The temperature is about 260 degrees when the soldering is done, and about 240 degrees when the soldering is done.printed circuit boards

PCB circuit board heat resistance test:

  1. First prepare PCB production board and tin furnace.

5pcs of base plate (or laminated plate, finished plate) sampled 10*10cm;”(no foaming stratification of copper – containing substrates).

Substrate: above 10cycle;Compression plates: LOW CTE 150 and above;HTg material is above 10cycle;Normal material is above 5cycle.

Product board: LOW CTE 150 5cycle above;HTg material above 5cycle;Normal material is above 3 cycles.

  1. Set the temperature of the tin furnace at 288+/-5 degrees and adopt the contact temperature measurement and correction;

3, soak with a soft brush for flux, apply to the board face, reoccupy crucible 煹 pliers buccal test board into tin stove, timing out 10 SEC after cooling to room temperature, visual presence of foaming board appear, this is 1 cycle;

  1. If the problem of bubbling and blasting plate is detected by visual inspection, immediately stop the tin soak analysis of starting point f/m. If no problem is found, continue the cycle until the plate is exploded, with 20 times as the end point;
  2. Slice analysis is needed at the bubbling area to understand the source of the detonation point and take pictures.

The above content is about the temperature resistance of PCB, PCB will produce some bad problems at the overheating temperature. Therefore, it is necessary to have a detailed understanding of the temperature resistance of PCB with different materials, and the maximum limit temperature should not be exceeded, so as to avoid the cost increase caused by the scrap of PCB.