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Give Pcb designers some thinking questions

Give Pcb designers some thinking questions

  1. What are the requirements for 0201, 01005 pad and template opening design? How to choose the thickness of the stencil, stencil processing method, and metal powder particle size? What are the common printing defects in 0201 and 01005 printing solder paste? How to improve printing accuracy?
  2. In the template design of the PQFN thermal pad, what are the different requirements for the template opening design of the four thermal vias? How does the solder paste coverage of the thermal pad affect the quality and thermal performance of reflow soldering? How many solder paste applying method of PQFN rework?
  3. What are the characteristics of flip chip? What are the two types of FC assembly methods? What is the non-flowing underfill process? What are the requirements for the mounting equipment for the flip chip assembly process?
  4. What is wafer-level CSP (WL-CSP)? What are the advantages of WL-CSP? What is wafer-level package WLP (Wafer Level Processing)? Write the process flow of SMT surface assembly board with WL-CSP.
  5. What are the requirements for PCB pad design in the underfill process?
  6. What are the basic requirements of PCBA solderless crimping process? Briefly describe the common problems of pressing input and output process .
  7. After reading “Introduction to SMT solderless electronic assembly process and Occam reverse order interconnection process”, what do you think?

4月-15-2020

FASTPCBA