Current page:

Home

/

News

/

Common pcb printing solder usage scene

Common pcb printing solder usage scene

Tin alloy

Sn 63 Pb 37 Usage: Proportion of alloys that most commonly used in printed circuit board assembly applications

Sn 60 Pb 40 Usage: Usually applied in single-sided board soldering and soldering operations

Sn 55 Pb 45 Usage: Not often used, except for high temperature soldering operation

Sn 50 Pb 50 Usage: Used in pcb welding of difficult-to-weld metals such as iron and steel.

Sn 40 Pb 60 Use: For high temperature applications, for the welding of automotive industry coolers
Sn30Pb70 usage: used to repair car dents

No.123 Usage: Low tin slag alloy for high temperature tinning line operation

Sn20Pb80 usage: Not often used, except in the automotive industry

Sn10Pb90 usage: BGA package in PCB manufacturing and CGA ball

Sn05Pb95 usage: high temperature alloy, rarely used

 

Lead-free alloy:

Sn96.5Ag3.5 usage: high temperature alloy, the formed solder joint has high strength

Sn96Ag04 usage: will be used when high-strength solder joints are required

Sn95Ag5 use: it will be used when high-strength solder joints are required

100%Sn use: added to the tin furnace to supplement the loss of tin

Sn95Sb05 use: high temperature solder usage

SAF-A-LLOY use: alloy developed for lead-free processes

 

Other alloys:

Sn60Pb36Ag02 Usage: For the welding of silver-board ceramic circuit boards or silver and palladium conductors

Sn10Pb88Ag04 Usage: Used for welding silver plated ceramic board or silver and palladium conductors to avoid the loss of silver

Sn10Pb88Ag02 Usage: For products in high temperature working environment

Sn05Pb93.5Ag1.5 Use: For products in high temperature working environment

Sn05Pb92.5Ag2.5 usage: the eutectic temperature in the solder alloy and the highest

Sn43Pb43Bi14 use: low temperature solder alloy

8月-07-2019

FASTPCBA