/Circuit boards common reliability test evaluation methods
Due to the pcb manufacturing and assembly components’ differences in package structure, weld height, size, etc., when using high and low temperature cycle test methods for life evaluation, the results may vary greatly due to different test conditions. The industry has basically abandoned the use of high and low temperature cycling methods to estimate the life of circuit boards, and has used it more often to find short-life circuit board solder joints.
At present, the industry, especially some large companies, for example, FASTPCBA has adopted simulation analysis technology. It is said that the error is tiny, and it can be accurate to the life span error of 1 to 2 years of the circuit board. This is almost several times of the error that the test can achieve.The following are acceleration coefficient values for solder joint life estimation according to the standard.
1.lead solder joint
The life evaluation methods of leaded BGA solder joints are as below table (Sn63Pb37 solder joints)
|Cycle/day||No failure cycles||Acceleration coefficient|
Equivalent market for 5 years
|Equivalent market for 10 years|
2.Lead-free solder joints
The life evaluation methods of lead-free BGA solder joints are as below table (SAC305 solder joints)
|Cycle/day||No failure cycles||Acceleration coefficient
|Equivalent market for 5 years||Equivalent market for 10 years|
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