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Circuit boards common reliability test evaluation methods

Circuit boards common reliability test evaluation methods

Due to the pcb manufacturing and assembly components’ differences in package structure, weld height, size, etc., when using high and low temperature cycle test methods for life evaluation, the results may vary greatly due to different test conditions. The industry has basically abandoned the use of high and low temperature cycling methods to estimate the life of circuit boards, and has used it more often to find short-life circuit board solder joints.

At present, the industry, especially some large companies, for example, FASTPCBA has adopted simulation analysis technology. It is said that the error is tiny, and it can be accurate to the life span error of 1 to 2 years of the circuit board. This is almost several times of the error that the test can achieve.The following are acceleration coefficient values for solder joint life estimation according to the standard.

1.lead solder joint

The life evaluation methods of leaded BGA solder joints are as below table (Sn63Pb37 solder joints)

 condition

 

T㏕/℃

 

T max/℃

 

∆T/℃

 

Cycle/day No failure cycles Acceleration coefficient
 

Equivalent market for 5 years

Equivalent market for 10 years
市场 makert 25 70 45 1 1825 3650
A -40 125 165 72 365 730 5.0
B -25 125 150 435 869 4.2
C -30 80 110 1217 2433 1.5

 

2.Lead-free solder joints

The life evaluation methods of lead-free BGA solder joints are as below table (SAC305 solder joints)

 

condition

 

T㏕/℃

 

T max/℃

 

∆T/℃

 

Cycle/day No failure cycles Acceleration coefficient

 

Equivalent market for 5 years Equivalent market for 10 years
市场 25 70 45 1 1825 3650
A -40 125 165 40 119 239 15.3
B -25 125 150 135 270 13.5
C -30 80 110 493 986 3.7

 

1月-17-2020

FASTPCBA