/PCB manufacturing BGA package advantages and disadvantages
BGA packages come in the form of PBGA, CBGA, CCGA, TBGA, so what are their advantages and disadvantages in the manufacturing process of circuit boards?
PBGA advantages: low packaging cost; pin is not easy to deform; high solderability
PBGA disadvantages: easy to absorb moisture; after removal, need to re-ball
Advantages of CBGA: high electrical, thermal and mechanical properties; good corrosion and moisture resistance
Disadvantages of CBGA: When the package size is large, the CTE mismatch between the ceramic and the substrate is likely to cause thermal cycle failure.
Advantages of CCGA: The solder column can withstand the stress caused by different CTE between components and PCB
CCGA Disadvantages: Solder posts are more susceptible to mechanical damage than solder balls during pcb assembly
Advantages of TBGA: small size, light weight; excellent electrical performance; easy batch assembly; good matching with PCB CTE
TBGA disadvantages: easy to absorb moisture; high packaging cost
Due to the superior performance of BGA in circuit board manufacturing, large-scale integrated circuits with more than 200 I/O terminals are mostly in BGA package form, and 3GA integrated circuits have been widely used in modern electronic products. For example, the CPU, bus controller, data controller, display controller chip, etc. in the computer are all packaged in BGA, and the package form is mostly PBGA; the central processor chip in the mobile phone is also packaged in BGA, and the package form is mostly uBGA.
The above are the advantages and disadvantages of various packaging forms, I hope to help you!
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