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Circuit board aging test

Circuit board aging test

Pcb prototypes samples need to be aged prior to solderability testing. Because the solderable surface of the component or PCB circuit board that has just been produced is generally not problematic, it will deteriorate due to oxidation after being stored for a period of time. The test must consider the effect of normal storage conditions on solderability.

 

In the pcb electronics manufacturing industry, components and PCBs often require a certain storage life, usually 6 to 12 months. Therefore, it is obviously impractical to wait for the testing after this period, so it is necessary to adopt an accelerated storage aging method. The IPC Research Group conducted a special study on accelerated aging, ranging from 1 hour steam aging to one month or several months of hot and humid conditions testing techniques. Finding the suitability of a technology depends on the metal properties of the solder joint coating and the expected cause of the product quality degradation. Oxidation is a major cause of tin alloys, and diffusion is a major cause for precious metal coatings. The general practice in the electronics manufacturing industry is to use 8 to 24 hours of steam aging for tin alloys, 115 ° C, 16 h dry heat aging for coatings that are mainly caused by diffusion, and 160 ° C for 16 h dry heat aging. For coatings with unknown quality degradation mechanism, steam aging is adopted.

11月-14-2019

FASTPCBA